TestOut LabSim A+ Certification Practice Exam

Which objects should have thermal paste applied?

1. CPU; Heat sink

2. Motherboard; RAM

3. Graphics card; Power supply

4. Storage drive; Optical drive

The correct answer is: CPU; Heat sink

Thermal paste is a crucial material used to enhance thermal conductivity between heat-producing components and their heat-dissipating counterparts. In this case, applying thermal paste is essential for the CPU and the heat sink. The CPU generates a significant amount of heat when operating, and it needs an effective mechanism for heat dissipation to prevent overheating and potential damage. The heat sink is designed to absorb this heat from the CPU and dissipate it into the surrounding air. Thermal paste fills microscopic imperfections between the CPU and the heat sink, facilitating better heat transfer. Without thermal paste, there would be air gaps that can significantly hinder the efficiency of heat transfer, leading to higher temperatures and reduced performance. The other options do not require thermal paste application. For instance, the motherboard and RAM do not have direct heat transfer requirements that necessitate the use of thermal paste. Similarly, the graphics card's cooling system typically comes pre-applied with thermal paste between the GPU and its heat sink or cooling solution. Power supplies, as well as storage and optical drives, do not typically involve components where thermal paste is utilized, as they either operate at lower temperatures or have different cooling mechanisms. Thus, only the CPU and heat sink are the correct context for applying thermal paste.